PCB Capability
ltem | Mass Production | Prototype | |
| Surface Treatment | HASL(LF) | HASL(LF) | |
| Immersion Gold | Immersion Gold | ||
| Flash Gold | Flash Gold | ||
| OSP | OSP | ||
| Immersion Tin | Immersion Tin | ||
| Immersion Silver | Immersion Silver | ||
| HASL&Gold Finger | HASL&Gold Finger | ||
| selective nickel | selective nickel | ||
| HASL(LF) | smt Pad：>3um | smt Pad：>4um | |
| Big Cu：>lum | Big Cu：>l.5um | ||
| Immersion Tin | 0.4-0.8um | 0.8-1.2um | |
| Immersion Gold | Ni：2-5urn | Ni：3-6urn | |
| Au:0.05-0.10um | Au:0.075-0.15um | ||
| Immersion Silver | 0.2-0.6um | 0.3-0.6um | |
| OSP | 0.1-0.4um | 0.25-0.4um | |
| Flash Gold | Ni：3-6urn | Ni：3-6urn | |
| Au:0.01-0.05um | Au:0.02-0.075um | ||
| Laminates | CEM-3、PTFE | CEM-3、PTFE | |
| FR一4 (HighTG etc) | FR一4(HighTG etc) | ||
| Metal Base(AL、CUetc) | Metal Base(AL、CUetc) | ||
| Rogors、etc | Rogors、etc | ||
| MAX．Layers | 12(Layers) | 40(Layers) | |
| MAX.Board Size | 20"X48" | 20"X48" | |
| Board Thickness | O．4mm～6．0mm | ||
| Max．Copper Thickness | inner Layer：4oz | inner Layer：5oz | |
| Outer Layer：10oz | Outer Layer：10oz | ||
| Min.Track Width | 3mil／0．075mm | 3mil／0.075mm | |
| Min．Track Space | 3mil／0．075mm | 3mil／0.075mm | |
| M.in Hole Size | 8mil／0.2mm | 6mil／0.1mm | |
| M．in Laser Hole Size | 4mil／0.1mm | 3mil／0.076mm | |
| PTH Wall Thickness | 0.8mil／20um | 1.2mil／30um | |
| PTH Dia．Tolerance | ±2mil/±50um | ±2mil/±50um | |
| Aspect Ratio | 12:1 | 15:1 | |
| lmpedance Control | ±5% | ±5% | |
HDI TECHNOLOGY | |||
Item | Mass Produciton | Prototype | |
| HDI structure | 1+N+1/2+N+2/3+N+3 | 1+N+1/2+N+2/3+N+3/4+N+4 | |
| Buried hole | Filled | Filled | |
| Aspect ratio | 0.75:1 | 1:1 | |
| Minimum laser hole | 0.1mm 4mil | 0.1 4mil | |
| Minimum laser pad | 0.25mm 10mil | 0.25mm 10mil | |
| Blind hole | YES | YES | |
| Rigid & Fled board | YES | YES | |
| Press fit hole | YES | YES | |
| Control Depth drilling | YES | YES | |
| Lead-free&Halogen-free | YES | YES | |
| Immersion Gold | Ni:2-5µm Au:0.05-0.10µm | Ni:3-6µm Au:0.075-0.15µm | |
| Immersion Tin | 0.6-1.2µm | 0.6-1.2µm | |
| Immersion silve | 0.2-0.6µm | 0.3-0.6µm | |
| OSP | 0.1－0.4µm | 0.25-0.4µm | |
| HASL(Sn-Pb&LF) | SMT Pad:>3µm Big Cu:>1µm | SMT Pad:>4µm Big Cu:>1.5µm | |
| Flash Gold | Ni:3-6µm Au:0.01-0.05µm | Ni:3-6µm Au:0.02-0.075µm | |
PCB Assembly Capability
