Description:
0402 placement
IC precision: 0.4mm pinch distance
Lead-free technology SMT process
Up to 22 layer mixed assembly technology used on industry controls or other fields
Specialized in assembling boards for network, communication, and industry control applications
Suitable for industry controls with layout, fabrication, and function test
Type of productions:
SMT and though-hole
BGA and COB
Plastic injection
Die casting
Sheet metal stamping
AOI,X-ray and ICT test
With IPC 610 manufacturing standards and other international standards
